EVG EVG 620 掩模对准曝光机用途：适用于半导体制造、MEMS 研发、先进封装等领域，能处理最大 6 英寸（150mm）晶圆，将掩模图案精准转移到晶圆表面，完成光刻制程，也常用于科研及小规模生产。性能：具备顶部对准和背面对准功能，顶部对准精度可达 0.5μm，背面对准精度为 1μm。支持软接触、硬接触、真空接触、接近式等曝光模式。采用 350W - 450W 汞灯光源，提供 350nm - 450nm 波长光线，光强均匀性达 4%。曝光精度为 1μm，可进行单次曝光、单面套刻、双面套刻。可处理 2 - 6 英寸衬底及碎片（单片），最大掩模版尺寸为 7 英寸 。

Product Name: EVG EVG 620 Mask AlignerPurpose: It is suitable for fields such as semiconductor manufacturing, MEMS R & D, and advanced packaging. It can handle wafers up to 6 inches (150mm) in size, accurately transfer the mask pattern onto the wafer surface to complete the lithography process, and is often used in scientific research and small - scale production.Performance: It has topside alignment and backside alignment functions. The topside alignment accuracy can reach 0.5μm, and the backside alignment accuracy is 1μm. It supports exposure modes such as soft contact, hard contact, vacuum contact, and proximity. It uses a 350W - 450W mercury lamp light source to provide light with wavelengths of 350nm - 450nm, and the light intensity uniformity is 4%. The exposure accuracy is 1μm, and it can perform single exposure, single - side overlay, and double - side overlay. It can process 2 - 6 - inch substrates and fragments (single piece), and the maximum mask size is 7 inches.