EVG IQ Aligner 自动掩模对准系统用途：适用于半导体、MEMS、纳米技术及先进封装等领域，可将掩模图案精准转移到晶圆表面，完成光刻制程。能处理最大 200mm（8 英寸）晶圆，常用于晶圆级芯片级封装、扇出晶圆级封装、3D - IC/TSV、2.5D 内插板与倒装芯片等先进封装类型，也用于聚合物微透镜制造等微纳加工。性能：具备先进光学设计，对准精度可达亚纳米级。支持真空接触、硬接触、软接触、接近式、弯曲模式等曝光模式，以及间隔曝光和洪水曝光选项。上侧对准精度≤±0.5µm，底侧对准精度≤±1.0µm，红外校准精度≤±2.0µm（因基板材料而异）。拥有自动楔形补偿功能，可处理易碎、薄或翘曲的晶圆。显微镜为全电动分场显微镜，配备高分辨率 CCD 相机，有 5x 物镜（也有 3.6x - 20x 可选）。光源方面，有 500W - 1000W 汞灯，提供 280 - 450nm 波长范围光线，在 150mm 范围内光强均匀度为 ±4%，200mm 范围内为 ±5% 。

Product Name: EVG IQ Aligner Automated Mask Alignment SystemPurpose: It is suitable for fields such as semiconductors, MEMS, nanotechnology, and advanced packaging. It can accurately transfer the mask pattern onto the wafer surface to complete the lithography process. It can handle wafers up to 200mm (8 inches) in size and is often used in advanced packaging types such as wafer - level chip - size packaging, fan - out wafer - level packaging, 3D - IC/TSV, 2.5D interposers, and flip - chips, as well as in micro - nano processing such as polymer microlens manufacturing.Performance: It has an advanced optical design with sub - nanometer alignment accuracy. It supports exposure modes such as vacuum contact, hard contact, soft contact, proximity, and bending mode, as well as exposure options such as interval exposure and flood exposure. The topside alignment accuracy is ≤±0.5µm, the bottom - side alignment accuracy is ≤±1.0µm, and the infrared calibration accuracy is ≤±2.0µm (varying depending on the substrate material). It has an automatic wedge compensation function and can handle fragile, thin, or warped wafers. The microscope is a fully motorized split - field microscope equipped with a high - resolution CCD camera and has a 5x objective (3.6x - 20x are also available). In terms of the light source, there is a 500W - 1000W mercury lamp providing light in the wavelength range of 280 - 450nm, with a light intensity uniformity of ±4% within 150mm and ±5% within 200mm.