阿斯麦 ASML PAS 5500 / 700D用途：主要用于半导体芯片制造领域，能够将掩模版上的电路图形精准地转移到涂有光刻胶的晶圆表面，适用于 150nm 设计规则的集成电路大规模生产，助力逻辑芯片、存储芯片等产品的制造 。性能：采用 248nm KrF 深紫外（DUV）光源，配备数值孔径达 0.70 的镜头，这在当时的行业中处于领先水平 。结合 ASML 专利的高强度 Aerial 照明器，可实现每小时 120 片 200mm 晶圆的高产量吞吐量，生产分辨率达 150nm 。该设备还配备 Athena 先进对准系统，能提高后端工艺层（包含 CMP 工艺）的对准精度，有效保障芯片制造过程中图形转移的准确性 。

Product Name: ASML PAS 5500 / 700DPurpose: It is mainly used in the semiconductor chip manufacturing field. It can accurately transfer the circuit patterns on the photomask to the surface of the wafer coated with photoresist. It is suitable for the mass production of integrated circuits with a 150nm design rule, contributing to the manufacturing of logic chips, memory chips and other products.Performance: It adopts a 248nm KrF deep ultraviolet (DUV) light source and is equipped with a lens with a numerical aperture of up to 0.70, which was at the leading level in the industry at that time. Combined with ASML's patented high - intensity Aerial illuminator, it can achieve a high - volume throughput of 120 200mm wafers per hour, with a production resolution of 150nm. The equipment is also equipped with an Athena advanced alignment system, which can improve the alignment accuracy of the back - end process layers (including the CMP process), effectively ensuring the accuracy of pattern transfer during the chip manufacturing process.