阿斯麦 ASML PAS 5000 / 55用途：用于半导体芯片制造，可将掩模版上的电路图形精准转移到涂有光刻胶的晶圆表面，适用于 0.5µm 制程的集成电路生产，常用于硅、砷化镓等多种基板，能制造逻辑芯片、存储芯片等各类芯片。性能：配备 0.48NA i-line 镜头，像场为 21.2mm ，可实现 0.5µm 分辨率 。采用快速线性电动曝光台和相位光栅对准系统，套刻性能出色。仅需两个对准标记，可大幅缩短对准时间。具备用户友好型软件，在多步进器设置中能简化计量测试，助力优化设计规则、提高良品率。其高速载物台无需预送晶圆，保障了高生产率和高精度，还集成了与 SMIF 兼容的高速标线片管理系统，可处理 4.5 英寸或 6 英寸晶圆 。

Product Name: ASML PAS 5000 / 55Purpose: It is used in semiconductor chip manufacturing to accurately transfer the circuit patterns on the photomask to the surface of the wafer coated with photoresist. It is suitable for the production of integrated circuits with a 0.5µm process. It is often used on various substrates such as silicon and gallium arsenide and can manufacture various chips such as logic chips and memory chips.Performance: It is equipped with a 0.48NA i-line lens with a 21.2mm field, which can achieve a resolution of 0.5µm. It adopts a fast linear - electric exposure stage and a phase grating alignment system, resulting in excellent overlay performance. With only two alignment marks required, the alignment time can be greatly shortened. It has user - friendly software that can simplify metrology tests in multi - stepper setups, helping to optimize design rules and improve the yield. Its high - speed stage does not require pre - sent wafers, ensuring high productivity and high precision. It also integrates a SMIF - compatible high - speed reticle management system and can process 4.5 - inch or 6 - inch wafers.