阿斯麦 ASML PAS 5500 / 300C用途：该设备用于半导体芯片制造领域，将掩模版上的电路图形精准转移至涂有光刻胶的晶圆表面，适用于 150nm 及以上制程的集成电路生产，可助力制造逻辑芯片、存储芯片等多种芯片 。性能：采用 248nm KrF 深紫外光源，搭配蔡司镜头，数值孔径在 0.63 至 0.40 间可变 。运用激光控制载物台运动的步进重复曝光系统，具备可编程环形照明模式，曝光视场大小为 22mm×22mm 。具备 3D 背面晶圆对准功能，最小特征尺寸小于 0.20µm，套刻精度通常小于 0.045µm 。可处理 3 英寸至 200mm（8 英寸）的晶圆，每小时能够处理 88 个 200mm 晶圆，生产效率较高 。

Product Name: ASML PAS 5500 / 300CPurpose: This equipment is used in the semiconductor chip manufacturing field to accurately transfer the circuit patterns on the photomask to the surface of the wafer coated with photoresist. It is suitable for the production of integrated circuits with a process of 150nm and above and can help manufacture various chips such as logic chips and memory chips.Performance: It adopts a 248nm KrF deep ultraviolet light source and is equipped with a Zeiss lens with a variable numerical aperture ranging from 0.63 to 0.40. It uses a step - and - repeat exposure system with laser - controlled stage motion, has programmable annular illumination modes, and the exposure field size is 22mm×22mm. It has a 3D back - side wafer alignment function, with a minimum feature size of less than 0.20µm and an overlay accuracy of usually less than 0.045µm. It can process wafers from 3 inches to 200mm (8 inches) and can process 88 200mm wafers per hour, with high production efficiency.