卡尔・休斯 KARL SUSS MICROTEC MA 25 掩模对准曝光机用途：适用于半导体制造、MEMS 研发、微纳结构制作等领域，可将掩模图案精准转移到最大 5 英寸的晶圆、芯片或其他基底表面，完成光刻制程。也常用于处理较小尺寸芯片及非标准基底。性能：配备分光显微镜，有 3.5 倍、10 倍、25 倍物镜及 10 倍双目目镜，具备顶部对准（TSA）和背面对准（BSA）功能，有分视场、全左图像、全右图像三种观察模式。曝光光源为 350W 高压汞灯，输出 365nm 和 405nm 波长光线，功率 9.5 - 10.5mW。晶圆台可通过 X、Y 和 θ 微调器控制移动。拥有标准软接触、标准硬接触、软真空和全真空四种晶圆与掩模接触模式，可满足不同分辨率需求，其中真空模式仅适用于标准 5 英寸玻璃掩模搭配 4 英寸晶圆 。

Product Name: KARL SUSS MICROTEC MA 25 Mask AlignerPurpose: It is suitable for fields such as semiconductor manufacturing, MEMS R & D, and micro - nano structure fabrication. It can accurately transfer the mask pattern onto the surface of wafers, chips, or other substrates up to 5 inches in size to complete the lithography process. It is also often used for processing smaller chips and non - standard substrates.Performance: It is equipped with a split - field microscope, with 3.5x, 10x, 25x objectives and 10x binocular eyepieces. It has topside alignment (TSA) and backside alignment (BSA) functions and three viewing modes: split - field, full left - hand image, and full right - hand image. The exposure light source is a 350W high - pressure mercury lamp, which outputs light with wavelengths of 365nm and 405nm, and the power is 9.5 - 10.5mW. The wafer stage movement is controlled by X, Y and theta aligning verniers. There are four wafer - to - mask contact modes: standard soft contact, standard hard contact, soft vacuum and full vacuum, which can meet different resolution requirements. The vacuum mode is only applicable to the standard 5 - inch glass mask with 4 - inch wafers.