https://rc0.zihu.com/g5/M00/3F/FC/CgAGbGiMePuAYza6AATtZSHZfis19.jpeg,https://rc0.zihu.com/g5/M00/3F/FC/CgAGbGiMeP-AKTFnAAPLLjBXppk46.jpeg,https://rc0.zihu.com/g5/M00/3F/FC/CgAGbGiMeP-AaBTtAAM0E8n-8Sc13.jpeg,https://rc0.zihu.com/g5/M00/3F/FC/CgAGbGiMeQCAYYwbAAOHOJRqfO007.jpeg
https://rc0.zihu.com/g5/M00/3F/FC/CgAGbGiMePuAYza6AATtZSHZfis19.jpeg
阿斯麦 ASML 455.59892-PO56 光刻机零部件

库存状态:现货

阿斯麦 ASML 455.59892 - PO56用途:由于缺乏公开的官方信息,从 ASML 的业务领域推断,该型号大概率是其光刻机相关的关键组件。可能应用于光刻机的光学、机械或电气系统,对光刻机的精准运行、光路传导、部件协同等方面起重要作用,进而保障光刻环节中,掩模版上的电路图形能精确转移到晶圆表面,服务于半导体芯片制造 。性能:因未掌握具体参数,以 ASML 产品特性推测,若为光学部件,或许适配如 193nm ArF、248nm KrF 等常见光源,拥有较高数值孔径,助力实现 7nm - 14nm 等先进制程的高分辨率光刻;若属电气组件,可能具备精准的电压、电流调控能力,降低电气干扰对光刻精度的影响,确保设备稳定运行;若是机械部件,应具备极高的加工精度和稳定性,使晶圆台等关键部件的运动精度达到亚微米甚至纳米级,满足芯片制造对高精度的严苛要求 。

Product Name: ASML 455.59892 - PO56Purpose: Due to the lack of public official information, inferring from ASML's business areas, this model is most likely a key component related to its lithography machines. It may be applied to the optical, mechanical, or electrical systems of lithography machines, playing an important role in aspects such as the precise operation of the lithography machine, light path conduction, and component coordination. Thus, it ensures that the circuit patterns on the photomask can be accurately transferred to the wafer surface during the lithography process, serving semiconductor chip manufacturing.Performance: Since specific parameters are not available, inferring from the characteristics of ASML products, if it is an optical component, it may be adapted to common light sources such as 193nm ArF and 248nm KrF, with a high numerical aperture, helping to achieve high - resolution lithography for advanced processes such as 7nm - 14nm. If it is an electrical component, it may have precise voltage and current regulation capabilities, reducing the impact of electrical interference on lithography accuracy and ensuring the stable operation of the equipment. If it is a mechanical component, it should have extremely high processing accuracy and stability, enabling the movement accuracy of key components such as the wafer stage to reach the sub - micron or even nanometer level, meeting the stringent requirements for high precision in chip manufacturing.

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