阿斯麦 ASML XT 1700FI 光刻机用途：专为 300mm 晶圆的大规模生产打造，用于先进半导体芯片制造，可实现 50nm 及以下分辨率的光刻，助力制造高性能、高集成度的芯片，在推动半导体工艺向更先进制程发展中发挥关键作用。性能：采用 193nm ArF 浸没式光刻技术，配备数值孔径 1.2 的在线折反射镜头，该镜头紧凑且机械稳定性强，与折射设计的图像方向一致，确保与现有折射设计的掩模版完全兼容。照明器在最大吞吐量下具备偏振功能，光瞳填充极为均匀，完美适配超低 k1 光瞳形状。通过优化偏振模式，可增强标准及定制照明模式，最大化对比度并降低掩模误差因子。套刻与聚焦要求符合分辨率节点标准。先进的平台技术实现更快加速，减少浸没相关的额外时间，晶圆处理量达每小时 122 片。还配备扩展的超 k1 套件，包含多种增强功能，如准分子激光（Quasar XL）、光刻引导系统（Litho Guide）等 。

Product Name: ASML XT 1700FI Lithography MachinePurpose: It is specifically designed for the mass production of 300mm wafers and is used in advanced semiconductor chip manufacturing. It can achieve lithography with a resolution of 50nm and below, helping to manufacture high - performance and highly integrated chips and playing a key role in promoting the development of semiconductor processes to more advanced nodes.Performance: It adopts 193nm ArF immersion lithography technology and is equipped with a 1.2 numerical aperture in - line catadioptric lens. This lens is compact and mechanically stable, with the same image orientation as refractive designs, ensuring full reticle compatibility with existing refractive designs. The illuminator features polarization at maximum throughput and extremely homogeneous pupil fill, perfectly adapted to ultra - low k1 pupil shapes. By optimizing the polarization mode, standard and customized illumination modes can be enhanced to maximize contrast and reduce the mask error factor. Overlay and focus requirements meet the resolution node standards. Advanced stage technology enables faster acceleration and minimizes immersion - related overhead, with a wafer throughput of 122 wafers per hour. It is also equipped with an extended ultra - k1 package, including various enhanced functions such as Quasar XL and Litho Guide.