阿斯麦 ASML XT 1950Hi 光刻机用途：主要用于半导体芯片制造领域，专注于 300mm 晶圆的大规模生产，能够实现 38nm 及更先进制程节点的光刻工艺，助力生产高性能的逻辑芯片、存储芯片等，在推动半导体芯片向更小尺寸、更高集成度发展中扮演关键角色。性能：采用 193nm ArF 浸没式光刻技术，搭配数值孔径高达 1.35 的蔡司镜头，实现 38nm 的高分辨率 。套刻精度可达 4nm（单次曝光多重图形技术，SMO）/7nm（多次曝光多重图形技术，MMO） 。配备 60W 的 Cymer XLR-560i 193nm 激光光源，每小时可处理 148 片 300mm 晶圆（125 次曝光，30mJ 能量） 。具备先进的 Aerial XP 照明系统，支持 P 型照明器，可实现高精度对准与逐场调平。拥有多种增强功能，如准分子激光（Quasar XL）、光刻引导系统（Litho Guide Ilias）、剂量映射器（Dose Mapper）等，以满足复杂光刻需求 。

Product Name: ASML XT 1950Hi Lithography MachinePurpose: It is mainly used in the semiconductor chip manufacturing field, focusing on the mass production of 300mm wafers. It can achieve lithography processes at 38nm and more advanced process nodes, helping to produce high - performance logic chips, memory chips, etc., and playing a key role in promoting the development of semiconductor chips towards smaller sizes and higher integration.Performance: It adopts 193nm ArF immersion lithography technology and is equipped with a Zeiss lens with a numerical aperture as high as 1.35 to achieve a high resolution of 38nm. The overlay accuracy can reach 4nm (Single Patterning with Multiple Exposures, SMO)/7nm (Multiple Patterning with Multiple Exposures, MMO). It is equipped with a 60W Cymer XLR - 560i 193nm laser light source and can process 148 300mm wafers per hour (125 exposures, 30mJ energy). It has an advanced Aerial XP illumination system that supports a P - type illuminator and can achieve high - precision alignment and field - by - field leveling. It has a variety of enhanced functions, such as Quasar XL, Litho Guide Ilias, Dose Mapper, etc., to meet complex lithography requirements.