OAI 6008SABA-105237 掩模对准曝光机用途：适用于半导体、MEMS、传感器、先进晶圆级封装、化合物半导体、LED 以及扇出型面板级封装等领域，能将掩模图案精准转移到晶圆或基底上，实现光刻制程。性能：采用全自动盒对盒系统，具备亚微米分辨率。曝光模式有真空接触、硬接触、软接触、接近式（20μm 间隙）；先进的光束光学系统，均匀性优于 ±3%；视场为 2 英寸 - 200mm 方形 / 圆形、200mm - 300mm 方形 / 圆形；可处理多种晶圆，如厚晶圆、键合晶圆（厚度达 7000μm）、翘曲晶圆（翘曲度达 7mm - 10mm）、薄晶圆（薄至 100μm）以及厚光刻胶；具备正面和可选的背面对准功能，采用康耐视图案识别软件与 OAI 图案辅助软件，提升整体吞吐量。

Product Name: OAI 6008SABA - 105237 Mask AlignerPurpose: It is suitable for fields such as semiconductors, MEMS, sensors, advanced wafer - level packaging, compound semiconductors, LEDs, and fan - out panel - level packaging. It can accurately transfer the mask pattern onto wafers or substrates to achieve the lithography process.Performance: It adopts a fully automated cassette - to - cassette system with sub - micron resolution. Exposure modes include vacuum contact, hard contact, soft contact, and proximity (20μm gap). It has an advanced beam optical system with uniformity better than ±3%, and the field of view is 2 - inch - 200mm square/round, 200mm - 300mm square/round. It can handle a variety of wafers, such as thick and bonded wafers (up to 7000μm thick), warped wafers (up to 7mm - 10mm warpage), thin wafers (as thin as 100μm), and thick photoresist. It has topside and optional bottom - side alignment functions, using Cognex pattern recognition software and OAI pattern assist software to improve overall throughput.