阿斯麦 ASML Twinscan AT 850D 光刻机用途：主要用于半导体芯片制造，能够处理 200mm 与 300mm 晶圆，适用于 100nm 制程的大规模芯片生产，通过将掩模版上的电路图形精准曝光到涂有光刻胶的晶圆表面，完成光刻制程，广泛应用于逻辑芯片、存储芯片等制造环节。性能：采用 248nm KrF 激光光源，搭配数值孔径 0.80 的 Carl Zeiss Star Lith 850 先进投影光学系统 。每小时可处理 95 片 300mm 晶圆，具备双晶圆台技术，一个晶圆曝光时，另一晶圆可同步进行测量与对准，提升生产效率 。可实现 110nm 分辨率，套刻精度满足 100nm 制程生产需求。具备先进的软件套件，支持高级图案识别与光刻操作，其高精度的镜头导航与对准系统，能精准在不同图案区域间移动坐标，保障光刻过程中晶圆的一致性 。

Product Name: ASML Twinscan AT 850D Lithography MachinePurpose: It is mainly used in semiconductor chip manufacturing and can process 200mm and 300mm wafers. It is suitable for the mass production of chips with a 100nm process. By accurately exposing the circuit patterns on the photomask onto the surface of the wafer coated with photoresist, the lithography process is completed, and it is widely used in the manufacturing of logic chips, memory chips, etc.Performance: It adopts a 248nm KrF laser light source and is equipped with a Carl Zeiss Star Lith 850 advanced projection optical system with a numerical aperture of 0.80. It can process 95 300mm wafers per hour and has a dual - wafer stage technology. While one wafer is being exposed, the other wafer can be measured and aligned simultaneously to improve production efficiency. It can achieve a resolution of 110nm, and the overlay accuracy meets the production requirements of the 100nm process. It has an advanced software suite that supports advanced pattern recognition and lithography operations. Its high - precision lens navigation and alignment system can accurately move coordinates between different pattern areas, ensuring the consistency of wafers during the lithography process.