卡尔・休斯 KARL SUSS MICROTEC MJB-45S 掩模对准曝光机用途：用于半导体制造、MEMS、光电子等微纳加工领域，将掩模图案精准转移到基板上，实现光刻制程。适用于小尺寸基板及晶圆加工，也可处理非标准基板如混合、高频元件及易碎的 III-V 族材料。性能：可处理直径达 4 英寸、厚度至 5mm 的基板。采用 350 瓦 Hg/Xe 灯，主要提供 365nm 和 405nm 波长的紫外光。405nm 峰值处校准为 20mJ / 秒，总宽带剂量约 30mJ / 秒。具备 3 英寸和 4 英寸卡盘，还有针对厚基板的特殊卡盘（需申请安装）。有 4 英寸和 5 英寸掩模支架，支持泛光曝光，具备软、硬和真空接触模式，能进行顶面对准。载物台行程 10mm，显微镜物镜行程 100mm，可选分视场相机。可实现 1:3 的标准纵横比，在真空接触模式下分辨率达 1μm ，位置对准精度约 1μm。

Product Name: KARL SUSS MICROTEC MJB - 45S Mask AlignerPurpose: It is used in micro - nano processing fields such as semiconductor manufacturing, MEMS, and optoelectronics. It accurately transfers the mask pattern onto the substrate to achieve the lithography process. It is suitable for processing small - sized substrates and wafers, and can also handle non - standard substrates such as hybrids, high - frequency components, and fragile III - V materials.Performance: It can process substrates with a diameter of up to 4 inches and a thickness of up to 5mm. It uses a 350 - watt Hg/Xe lamp to mainly provide ultraviolet light with wavelengths of 365nm and 405nm. It is calibrated to 20mJ/second at the 405nm peak, and the total broadband dose is about 30mJ/second. It has 3 - inch and 4 - inch chucks, as well as a special chuck for thick substrates (installation requires application). There are 4 - inch and 5 - inch mask holders, supports flood exposure, has soft, hard, and vacuum contact modes, and can perform topside alignment. The stage travel is 10mm, the microscope objective travel is 100mm, and a split - field camera can be selected. It can achieve a standard aspect ratio of 1:3, and the resolution in vacuum contact mode reaches 1μm, with a position alignment accuracy of about 1μm.