卡尔・休斯 KARL SUSS MICROTEC MA 200 E 掩模对准曝光机用途：专为大批量生产设计，适用于 200 毫米及以下晶圆和方形衬底的自动化加工。广泛应用于厚胶工艺 MEMS 生产、有凹凸图形的 3D 结构制造，以及 3D 封装、扇出封装、凸点封装、化合物半导体和图像传感器等封装应用领域。性能：基于 Windows 系统，搭配 Suss Al / 自动对准系统及 PC 自动调整（康耐视 Pat Mex）的顶部对准（TSA）功能。配备 Suss DVM 8 双视频显微镜（2 个 CCD 相机 / 左右旋转物镜组），含 5x、10x、20x 物镜各 2 个。可处理最大 8 英寸晶圆，有盒对盒自动传输功能。曝光光源通过 CIC 1200 电源供电，搭配类型 A/UV400 曝光光学元件，提供 365nm 和 405nm 波长光线。设有非接触式预对准工位，带红外传感器。

Product Name: KARL SUSS MICROTEC MA 200 E Mask AlignerPurpose: Specifically designed for high - volume production, it is suitable for the automated processing of wafers and square substrates of 200 mm and below. It is widely used in the production of MEMS with thick - film processes, the manufacturing of 3D structures with concave - convex patterns, and packaging applications such as 3D packaging, fan - out packaging, bump packaging, compound semiconductors, and image sensors.Performance: Based on the Windows system, it is equipped with the Suss Al/automatic alignment system and the topside alignment (TSA) function with PC - aut. adjustment (Cognex Pat Mex). It comes with a Suss DVM 8 dual - video microscope (2 CCD cameras/rotating objective lens sets on the left and right), including 2 each of 5x, 10x, and 20x objectives. It can handle wafers up to 8 inches in size and has a cassette - to - cassette automatic transfer function. The exposure light source is powered by a CIC 1200 power supply and is equipped with type A/UV400 exposure optics to provide light at wavelengths of 365nm and 405nm. There is a non - contact pre - alignment station with an infrared sensor.