维易科 VEECO ULTRATECH AP300 光刻系统用途：专为先进封装应用设计，如铜柱、扇出、硅通孔（TSV）和硅中介层，也适用于 LED、MEMS 和功率器件制造。性能：基于 Veeco 的 Unity 平台构建，提供 2μm 高分辨率、宽带投影镜头；曝光波长 350 - 450nm，可编程波长选择（GHI、GH、I），可优化工艺；高强度照明，减少曝光时间，提升系统吞吐量；大焦深，适用于厚光刻胶工艺和大型晶圆形貌；视场大小 68 x 26mm，快速系统载物台，具有自计量对准系统等。

Product Name: VEECO ULTRATECH AP300 Lithography SystemPurpose: Specifically designed for advanced packaging applications, such as copper pillars, fan - out, through - silicon vias (TSV), and silicon interposers. It is also suitable for the manufacturing of LEDs, MEMS, and power devices.Performance: Built on Veeco's Unity platform, it provides a 2μm high - resolution broadband projection lens. The exposure wavelength ranges from 350 to 450nm with programmable wavelength selection (GHI, GH, I) for process optimization. High - intensity illumination reduces exposure time and improves system throughput. It has a large depth - of - focus, suitable for thick resist processes and large wafer topography. The field size is 68 x 26mm, with a fast system stage and a self - metrology alignment system, etc.