日立 HITACHI FS300用途：广泛用于电子封装、陶瓷、金属树脂等材料的内部缺陷非破坏性检测，也适用于半导体封装检测芯片内部键合层空洞或焊接缺陷、工业材料分析评估陶瓷基板等完整性，以及研发与质控环节。技术原理：运用超声波技术，通过发射和接收声波，对检测对象内部结构进行扫描成像，从而识别纳米级孔隙、裂纹及界面剥离等缺陷，支持透射与反射同时测量模式，以适应不同材料结构分析。性能：配置最高频率达 600MHz 的宽带、高灵敏度超声波组件，搭配高精度扫描仪，可检测最小间距达 0.5μm；搭载高速自动测量系统，扫描速度最高 1000mm/s ，支持批量数据保存与分析；具备多种分析软件，可对波形、强度、深度等超声波数据进行分析。Product Name: HITACHI FS300Purpose: It is widely used for non - destructive inspection of internal defects in materials such as electronic packaging, ceramics, and metal resins. It is also suitable for detecting voids or welding defects in the internal bonding layers of chips in semiconductor packaging, evaluating the integrity of ceramic substrates in industrial material analysis, as well as in R & D and quality control.Technical Principle: It uses ultrasonic technology. By transmitting and receiving sound waves, it scans and images the internal structure of the inspected object to identify defects such as nano - level pores, cracks, and interface delamination. It supports the simultaneous measurement mode of transmission and reflection to adapt to the analysis of different material structures.Performance: It is equipped with broadband and high - sensitivity ultrasonic components with a maximum frequency of 600MHz, and is matched with a high - precision scanner, capable of detecting a minimum pitch of 0.5μm. It is equipped with a high - speed automatic measurement system with a maximum scanning speed of 1000mm/s, supporting batch data storage and analysis. It has a variety of analysis software that can analyze ultrasonic data such as waveforms, intensity, and depth.