赛默飞 FEI TEMLink 150 透射电子显微镜配套设备用途：主要用于半导体 IC 领域，配合双束聚焦离子束（FIB）系统，实现 300mm 晶圆上半导体集成电路的高容量、快速周转的自动化在线特定位置 TEM 样品制备，可从较小器件结构区域制备 TEM 样品，助力半导体工艺开发、良率提升、生产及失效分析等工作。技术原理：与 FEI CLM+™等双束 FIB/SEM 系统协同工作，通过工厂自动化和配方驱动步骤，在双束 FIB 工具端完成晶圆对准、保护层沉积、薄片制备、低 kV 清洗等操作，制备出典型尺寸为面积 2.0×2.4μm²、厚度 70nm（也可制备约 50nm 厚）的薄切片，再由 TEMLink 150 将其从原位转移到 3mm TEM 网格上 。性能：制备一片 70nm 厚薄片需 25 - 45 分钟，转移到 TEM 网格上需 2 分钟；能从 20nm 技术节点晶圆的较小器件区域成功制备样品，满足半导体先进制程对微观分析样品制备的需求 。Product Name: Thermo Fisher FEI TEMLink 150 Auxiliary Equipment for Transmission Electron MicroscopyPurpose: It is mainly used in the semiconductor IC field. In cooperation with the dual - beam focused ion beam (FIB) system, it realizes high - volume and fast - turnaround automated in - line site - specific TEM sample preparation for semiconductor integrated circuits on 300mm wafers. It can prepare TEM samples from smaller device structure regions, facilitating semiconductor process development, yield enhancement, production, failure analysis and other work.Technical Principle: It works in coordination with dual - beam FIB/SEM systems such as FEI CLM+™. Through factory automation and recipe - driven steps, operations such as wafer alignment, protective layer deposition, thin lamella preparation, and low kV cleaning are completed at the dual - beam FIB tool end. A thin lamella with a typical size of 2.0×2.4μm² in area and 70nm in thickness (about 50nm thick can also be prepared) is prepared, and then TEMLink 150 transfers it from the in - situ position to a 3mm TEM grid.Performance: It takes 25 - 45 minutes to prepare a 70nm - thick lamella and 2 minutes to transfer it to the TEM grid. Samples can be successfully prepared from smaller device regions of 20nm technology node wafers, meeting the needs of micro - analysis sample preparation for advanced semiconductor manufacturing processes.