日立 HITACHI HS - 9050 灰化设备用途：用于半导体制造等领域，对 12 英寸晶圆进行处理。能实现多腔室作业，可高效去除晶圆表面光刻胶等有机物质，助力后续芯片制造流程顺利开展 。技术原理：通过 lambda 源单元产生特定能量，促使反应气体（如氧气、四氟化碳等）与晶圆表面有机物质发生化学反应，将其转化为气态挥发，从而达到灰化目的 。性能：具备 7 个腔室，其中 5 个为灰化单元；配备多种质量流量控制器（MFC），可精准调控气体流量，如氧气最大流量 20L/min、四氟化碳最大流量 1L/min 等；有电容式压力计监测压力；采用射频电源（AXG - 5000 Ⅲ - 27M - KE）；具有多波长 0.1s 采样光谱仪用于监测反应 ；含 2 个冷却单元维持设备稳定运行 。Product Name: Hitachi HITACHI HS - 9050 AsherPurpose: It is used in fields such as semiconductor manufacturing to process 12 - inch wafers. It can achieve multi - chamber operation and efficiently remove organic substances such as photoresist on the wafer surface, facilitating the smooth progress of subsequent chip manufacturing processes.Technical Principle: The lambda source unit generates specific energy to promote a chemical reaction between reaction gases (such as oxygen, carbon tetrafluoride, etc.) and the organic substances on the wafer surface, converting them into gas for volatilization, thus achieving the purpose of ashing.Performance: It has 7 chambers, 5 of which are ashing units. It is equipped with a variety of mass flow controllers (MFCs) to accurately regulate gas flow, such as the maximum oxygen flow rate of 20 L/min and the maximum carbon tetrafluoride flow rate of 1 L/min. There is a capacitance manometer to monitor pressure. It uses a radio - frequency power supply (AXG - 5000 Ⅲ - 27M - KE) and has a multi - wavelength 0.1s sampling spectrometer to monitor the reaction. It also contains 2 cooling units to maintain the stable operation of the equipment.