东京精密 TOKYO SEIMITSU FP 2000用途：适用于电子制造领域，可对中小尺寸半导体封装器件（如 SOP、SOIC 等）进行外观缺陷检测与尺寸测量，广泛应用于消费电子、汽车电子等行业的质量检测环节。性能：检测范围覆盖 3mm×3mm 至 20mm×20mm 封装件，光学分辨率达 2μm。配备高速图像处理系统，检测速度达 1500 件 / 小时，缺陷识别最小尺寸 0.02mm。采用双光源互补照明，可识别引脚变形、表面污渍等缺陷。X/Y 轴定位精度 ±2μm，支持自动分拣功能，适配中等批量生产检测需求。

英文Product Name: TOKYO SEIMITSU FP 2000Purpose: It is applicable to the electronic manufacturing field, capable of appearance defect detection and dimension measurement of small and medium-sized semiconductor packaged devices (such as SOP, SOIC, etc.), and widely used in quality inspection links of consumer electronics, automotive electronics and other industries.Performance: The detection range covers 3mm×3mm to 20mm×20mm packages, with an optical resolution of 2μm. Equipped with a high-speed image processing system, the detection speed reaches 1500 pieces/hour, and the minimum defect recognition size is 0.02mm. Adopting dual-light source complementary lighting, it can identify defects such as pin deformation and surface stains. The X/Y axis positioning accuracy is ±2μm, supporting automatic sorting function, suitable for medium-batch production inspection needs.