尼康 NIKON OPTISTATION - 3200用途：用于 300mm 晶圆的人工视觉检测，能快速精准识别晶圆表面缺陷，是研发缺陷分析的得力工具，助力提升芯片生产良率 。技术原理：运用尼康 CFI60 光学设计，通过高对比度成像技术，让光线经光学系统处理，清晰呈现晶圆表面细节。可选配的深紫外（DUV）显微镜模块，满足更精细制程检测需求 。性能：搭载 CFI60 光学系统，生成高对比度、低眩光清晰图像，暗场信号与背景比是以往 3 倍；配备全新设计的 DUV 显微镜模块，支持 90nm 及未来设计规则；具备 3 模式宏观检测功能，新开发的宽（WIL - 100）和线（LIL - 100）照明器，可轻松检测多种工艺缺陷；检测倍率范围 25x 至 1500x 。

Product Name: NIKON OPTISTATION - 3200Purpose: It is used for manual visual inspection of 300mm wafers. It can quickly and accurately identify defects on the wafer surface and is a powerful tool for R & D defect analysis, helping to improve the yield of chip production.Technical Principle: It uses Nikon's CFI60 optical design. Through high - contrast imaging technology, the light is processed by the optical system to clearly present the details of the wafer surface. The optional deep ultraviolet (DUV) microscope module meets the needs of more refined process detection.Performance: Equipped with the CFI60 optical system, it generates clear images with high contrast and low glare. The dark - field signal - to - background ratio is three times that of the past. It is equipped with a newly designed DUV microscope module, which supports 90nm and future design rules. It has a 3 - mode macro inspection function. The newly developed wide (WIL - 100) and line (LIL - 100) illuminators can easily detect a variety of process defects. The detection magnification range is 25x to 1500x.