科磊KLA-TENCOR FPI-6099用途：主要用于半导体晶圆制造过程中的缺陷检测，能在芯片生产的光刻、蚀刻等环节，精准识别各类缺陷，助力提升芯片制造的良品率。技术原理：运用先进的光学成像与分析技术，通过多波段光源照射晶圆，收集不同角度的反射或散射光信号，利用专业算法对这些光信号进行处理和分析，从而清晰呈现晶圆表面微观状况，实现对缺陷的精准定位与类型判断。性能：检测精度可达0.1μm，可精准识别颗粒、划痕、图形偏移等超15种缺陷类型；检测速度快，每小时能完成约80片晶圆检测；检测均匀性佳，全晶圆覆盖无死角，边缘与中心缺陷识别一致性≥98% 。

Product Name: KLA-TENCOR FPI-6099Purpose: It is mainly used for defect detection in the semiconductor wafer manufacturing process. It can accurately identify various defects in the lithography, etching and other processes of chip production, helping to improve the yield of chip manufacturing.Technical Principle: It uses advanced optical imaging and analysis technology. By irradiating the wafer with multi - band light sources, it collects reflected or scattered light signals from different angles, and uses professional algorithms to process and analyze these light signals, thus clearly presenting the micro - conditions on the surface of the wafer and achieving accurate defect location and type judgment.Performance: The detection accuracy can reach 0.1μm, and it can accurately identify more than 15 types of defects such as particles, scratches, and pattern offsets. The detection speed is fast, and it can complete the detection of about 80 wafers per hour. It has good detection uniformity, covering the entire wafer without dead corners, and the defect recognition consistency at the edge and center is ≥98%.