科磊KLA-TENCOR AS-560用途：用于半导体晶圆表面缺陷检测，能精准识别在晶圆制造等环节中产生的各类缺陷，助力提升芯片制造良率 。技术原理：采用单波长光束照明技术，当光束照射到晶圆表面，若遇粒子或其他缺陷，部分激光会散射。设备收集这些缺陷散射光信号，通过多维度光学模式与多通道信号采集，实时识别缺陷、判别种类并报告位置 。性能：可对不同尺寸晶圆进行高效检测，检测精度高，能够有效识别极小尺寸的缺陷，满足半导体制造中对高精度检测的严苛要求，帮助企业及时发现生产过程中的问题，优化生产工艺 。

Product Name: KLA-TENCOR AS-560Purpose: It is used for detecting defects on the surface of semiconductor wafers. It can accurately identify various defects generated in the wafer manufacturing and other processes, helping to improve the yield of chip manufacturing.Technical Principle: It adopts single-wavelength beam illumination technology. When the beam irradiates the wafer surface, if it encounters particles or other defects, part of the laser will scatter. The equipment collects the scattered light signals of these defects, and through multi-dimensional optical modes and multi-channel signal acquisition, it can identify defects, distinguish types and report positions in real time.Performance: It can efficiently detect wafers of different sizes with high detection accuracy. It can effectively identify defects of extremely small sizes, meeting the strict requirements for high-precision detection in semiconductor manufacturing. It helps enterprises to promptly discover problems in the production process and optimize the production process.