科磊KLA-TENCOR PHX DF 5.0用途：主要用于半导体晶圆的缺陷检测，能够在晶圆制造过程中精准识别各类缺陷，助力提升芯片制造的良品率，保障生产质量 。技术原理：运用激光散射技术，当激光束照射晶圆表面，遇缺陷产生散射光，光学探测器收集散射光，通过分析其强度和分布来确定缺陷位置与类型。同时结合机器视觉及图像处理技术，实现缺陷的高精度成像与分类 。性能：可对15英寸晶圆进行高效检测；具备高灵敏度，能检测出极微小的缺陷，满足半导体先进制程的严苛要求；检测速度快，能够在短时间内完成大面积晶圆检测，提高生产效率 。

Product Name: KLA-TENCOR PHX DF 5.0Purpose: It is mainly used for defect detection of semiconductor wafers. It can accurately identify various defects during the wafer manufacturing process, helping to improve the yield of chip manufacturing and ensure production quality.Technical Principle: It uses laser scattering technology. When the laser beam irradiates the wafer surface, scattered light is generated when encountering defects. The optical detector collects the scattered light, and determines the location and type of defects by analyzing its intensity and distribution. At the same time, it combines machine vision and image processing technology to achieve high - precision imaging and classification of defects.Performance: It can efficiently detect 15 - inch wafers; has high sensitivity and can detect extremely small defects, meeting the strict requirements of advanced semiconductor manufacturing processes; has a fast detection speed and can complete the inspection of large - area wafers in a short time, improving production efficiency.