科磊 KLA-TENCOR WI-2000用途：用于半导体晶圆表面的缺陷检测以及关键尺寸测量，助力半导体制造企业精准把控晶圆质量，提升芯片生产良率。技术原理：运用激光散射技术，当激光照射晶圆表面，遇缺陷产生散射光，光学探测器收集并分析散射光的强度与分布，以确定缺陷位置与类型。同时结合先进的图像处理算法，实现对晶圆表面特征的高精度识别与测量 。性能：具备高灵敏度，可检测出极小尺寸缺陷，满足先进制程对晶圆检测的严苛要求；能快速完成大面积晶圆检测，提升生产效率；测量关键尺寸的精度极高，有效保障晶圆制造工艺的稳定性与一致性 。

Product Name: KLA-TENCOR WI-2000Purpose: It is used for defect detection and critical dimension measurement on the surface of semiconductor wafers. It helps semiconductor manufacturing enterprises accurately control wafer quality and improve the yield of chip production.Technical Principle: It uses laser scattering technology. When the laser irradiates the wafer surface, scattered light is generated when encountering defects. The optical detector collects and analyzes the intensity and distribution of the scattered light to determine the location and type of defects. At the same time, it combines advanced image processing algorithms to achieve high - precision recognition and measurement of wafer surface features.Performance: It has high sensitivity and can detect defects of extremely small sizes, meeting the strict requirements of advanced manufacturing processes for wafer inspection. It can quickly complete the inspection of large - area wafers and improve production efficiency. It has extremely high accuracy in measuring critical dimensions, effectively ensuring the stability and consistency of wafer manufacturing processes.