应用材料AMAT/APPLIED MATERIALS UVISION 4 MAIN用途：用于半导体晶圆的缺陷检测，可在芯片制造的光刻、蚀刻、薄膜沉积等多环节，精准识别各类缺陷，提升芯片制造良率。技术原理：采用高精度紫外光学成像技术，以紫外光（UV光源）为检测媒介。因紫外光穿透力强，能深入探测到晶圆内部，捕捉可见光难以察觉的细微缺陷，再结合智能算法对采集的图像进行分析，实现缺陷自动识别。性能：缺陷检测精度可达0.1μm，能精准识别颗粒、划痕、图形偏移、薄膜缺陷等超20类问题；检测速度为每小时约100片晶圆（WPH）；检测均匀性良好，全晶圆覆盖无死角，边缘和中心缺陷识别一致性≥99% 。

Product Name: AMAT/APPLIED MATERIALS UVISION 4 MAINPurpose: It is used for defect detection of semiconductor wafers. It can accurately identify various defects in multiple processes of chip manufacturing, such as lithography, etching, and thin - film deposition, improving the yield of chip manufacturing.Technical Principle: It adopts high - precision ultraviolet optical imaging technology, using ultraviolet light (UV light source) as the detection medium. Due to the strong penetration of ultraviolet light, it can deeply detect the interior of the wafer and capture subtle defects that are difficult to detect by visible light. Then, it combines with intelligent algorithms to analyze the collected images to achieve automatic defect recognition.Performance: The defect detection accuracy can reach 0.1μm, and it can accurately identify more than 20 types of problems such as particles, scratches, pattern offsets, and thin - film defects. The detection speed is about 100 wafers per hour (WPH). It has good detection uniformity, covering the entire wafer without dead corners, and the defect recognition consistency at the edge and center is ≥99%.