CVC AST 601 溅射沉积系统用途：适用于科研与工业领域的薄膜制备。可在半导体、光学、材料研究等行业的各类基底上，沉积金属、合金、氧化物、氮化物等薄膜，如制备半导体芯片的电极薄膜、光学镜片的功能性薄膜 。性能：是一款高度灵活的溅射系统，具备射频二极管、射频磁控、直流二极管、直流三极管及直流磁控溅射模式，还可选配射频偏压和射频溅射蚀刻功能。可容纳直径达 6 英寸的晶圆，配备旋转平台。基准压力能达到 1x10⁻⁶Torr，拥有 3kW 功率，支持在氧气或氮气中进行反应溅射，也能用氩气进行射频反溅射 / 清洗。

Product Name: CVC AST 601 Sputtering Deposition SystemPurpose: It is suitable for thin - film preparation in scientific research and industrial fields. It can deposit thin films such as metals, alloys, oxides, and nitrides on various substrates in industries like semiconductors, optics, and materials research, such as preparing electrode thin films for semiconductor chips and functional thin films for optical lenses.Performance: It is a highly flexible sputtering system with RF diode, RF magnetron, DC diode, DC triode, and DC magnetron sputtering modes. RF bias and RF sputter etch functions are also available as options. It can accommodate wafers up to 6 inches in diameter and is equipped with a rotating platform. The base pressure can reach 1x10⁻⁶Torr, it has a power of 3kW, supports reactive sputtering in oxygen or nitrogen, and can also perform RF back sputtering/cleaning with argon.