瓦里安 VARIAN 3180用途：是一款应用于半导体制造等领域的溅射设备，主要用于在晶圆表面进行薄膜溅射沉积，满足集成电路制造等工艺对金属薄膜制备的需求。性能：从 1981 年起采用晶圆盒到晶圆盒的操作模式，具备 4 个处理站。能处理直径 50mm 至 125mm 的晶圆，使用 200、208、360 或 480 伏的三相 60Hz 电源。配备三个 12kW 的溅射电源，每小时最高可处理 45 片晶圆，在沉积 1 微米厚铝合金薄膜时，速率可达每小时 60 片。该设备采用直流磁控溅射技术，竖直结构与单边溅射方式，3 个靶位各自配有直流电源与 SHUTTER，可用于预溅射并防止交叉污染 。

Product Name: VARIAN 3180Purpose: It is a sputtering device applied in fields such as semiconductor manufacturing. It is mainly used for thin - film sputtering and deposition on the surface of wafers to meet the requirements of metal thin - film preparation in processes such as integrated circuit manufacturing.Performance: Since 1981, it has adopted the cassette - to - cassette operation mode and has 4 processing stations. It can handle wafers with a diameter ranging from 50mm to 125mm and uses a three - phase 60Hz power supply of 200, 208, 360, or 480 volts. It is equipped with three 12kW sputtering power supplies and can process up to 45 wafers per hour. When depositing a 1 - micron - thick aluminum alloy film, the rate can reach 60 wafers per hour. The device adopts DC magnetron sputtering technology, with a vertical structure and a single - side sputtering method. Each of the 3 target positions is equipped with a DC power supply and a SHUTTER, which can be used for pre - sputtering and to prevent cross - contamination.