COMTECH 在线溅射系统用途：适用于纳米技术、材料研究、太阳能电池、触摸屏、TFT - LCD 等领域，可在柔性基板上沉积氧化物、氮化物和金属薄膜。能够处理最大尺寸达 1100 x 1300mm² 的玻璃基板，也适用于铜丝、铜带、光纤电缆、化纤丝等连续线材及带材的表面镀膜 。性能：具备出色的薄膜均匀性，偏差小于 ±5%。沉积速率高，≥250nm/min，且阴极效率高。溅射功率方面，射频为 5kW，直流或脉冲直流最大 20kW 。采用质量流量控制器，气体分布高度均匀。基板可加热至 400°C，温度控制稳定。支持垂直或水平溅射方式，配备载具返回系统和自动上料机器人，还具备基板射频等离子清洗功能 。

Product Name: COMTECH Inline Sputtering SystemPurpose: It is suitable for fields such as nanotechnology, materials research, solar cells, touch panels, and TFT - LCD. It can deposit oxide, nitride, and metal thin films on flexible substrates. It can handle glass substrates with a maximum size of 1100 x 1300mm², and is also applicable to the surface coating of continuous wires and strips such as copper wires, copper strips, fiber optic cables, and chemical fiber wires.Performance: It has excellent film uniformity with a deviation of less than ±5%. The deposition rate is high, ≥250nm/min, and the cathode efficiency is high. In terms of sputtering power, the RF power is 5kW, and the DC or pulsed - DC power is up to 20kW. It uses mass flow controllers with highly uniform gas distribution. The substrate can be heated up to 400°C with stable temperature control. It supports vertical or horizontal sputtering methods, is equipped with a carrier return system and an automatic loading robot, and also has a substrate RF plasma cleaning function.