巴尔查斯 BALZERS LLS 900 负载锁系统用途：主要用于电子薄膜沉积，可满足混合应用中复杂层叠结构的制备需求。适用于在电阻、接触层上添加隔离层，以及制备粘附层和阻挡层等，能在一次溅射过程中完成整个层叠结构制造，在半导体、电子器件等领域应用广泛 。性能：设备设有 4 个平面磁控溅射站，可选择直流（DC）或射频（RF）电源运行，搭配 3 个反应气体入口，可执行复杂工艺。采用自动控制系统，能精准控制和执行工艺参数，保障批次间的高重现性。其工艺腔室由低温泵抽气，锁腔室由涡轮泵抽气，极限压力低于5×10−8毫巴，典型工艺起始压力为5×10−7毫巴，关闭锁腔室后 15 分钟内可达到该压力。基板置于固定板上，通过两组固定板交替操作，在工艺腔室进行沉积时，锁腔室内可同时进行后处理、软排气、重新装载、抽气和预处理等操作 。

Product Name: BALZERS LLS 900 Load Lock SystemPurpose: It is mainly used for electronic thin film deposition and can meet the needs of preparing complex laminated structures in hybrid applications. It is suitable for adding isolation layers to resistor and contact layers, as well as preparing adhesion and barrier layers. It can complete the manufacturing of the entire laminated structure in a single sputtering process and is widely used in semiconductor, electronic device and other fields.Performance: The equipment is equipped with 4 planar magnetron sputtering stations, which can operate with either DC or RF power, and is equipped with 3 reactive gas inlets, enabling the execution of complex processes. It adopts an automatic control system that can accurately control and execute process parameters, ensuring high reproducibility between batches. Its process chamber is pumped by a cryopump, and the lock chamber is pumped by a turbopump. The ultimate pressure is less than 5×10−8 mbar, and the typical process starting pressure is 5×10−7 mbar, which can be reached within 15 minutes after closing the lock chamber. The substrates are placed on fixed plates. Through the alternating operation of two sets of fixed plates, while deposition is carried out in the process chamber, post-treatment, soft venting, reloading, pumping, and pre-treatment can be carried out simultaneously in the lock chamber.