瓦里安 VARIAN 3180/3190用途：是晶圆溅射系统，适用于半导体制造等领域，可在晶圆表面溅射沉积各类薄膜，满足芯片制造等工艺需求。性能：VARIAN 3180：从 1981 年起采用晶圆盒到晶圆盒操作模式，有 4 个处理站。可处理 50mm 至 125mm 的晶圆，使用 200、208、360 或 480 伏三相 60Hz 电源，三个溅射电源功率各为 12kW ，每小时最高处理 45 片晶圆，能以每小时 60 片的速率沉积 1 微米厚铝合金薄膜。VARIAN 3190：升级后的晶圆盒到晶圆盒溅射系统，真空系统改进，每小时最高处理 60 片晶圆，可处理 50mm 至 125mm 的晶圆，电源规格同 3180。具备自动化的晶圆盒到晶圆盒操作，配置有 3 个小型量子靶材，有射频蚀刻功能、真空隔离处理站（VIPS）及残余气体分析仪。可在不同工艺要求下实现高效且稳定的薄膜沉积，在沉积铝合金 1 微米薄膜时能保持较高产出效率，减少颗粒污染，提高良品率 。

Product Name: VARIAN 3180/3190Purpose: They are wafer sputtering systems, suitable for semiconductor manufacturing and other fields. They can sputter and deposit various thin films on the surface of wafers to meet the process requirements such as chip manufacturing.Performance:VARIAN 3180: Since 1981, it has adopted the cassette - to - cassette operation mode and has 4 processing stations. It can handle wafers from 50mm to 125mm, using 200, 208, 360 or 480 volts, three - phase 60Hz power. Each of the three sputtering power supplies has a power of 12kW. It can process up to 45 wafers per hour and can deposit a 1 - micron - thick aluminum alloy film at a rate of 60 wafers per hour.VARIAN 3190: It is an upgraded cassette - to - cassette sputtering system with an improved vacuum system. It can process up to 60 wafers per hour and can handle wafers from 50mm to 125mm, with the same power supply specifications as 3180. It has automated cassette - to - cassette operation, is equipped with 3 mini - quantum targets, has an RF etch function, a vacuum - isolated processing station (VIPS), and a residual gas analyzer. It can achieve efficient and stable thin - film deposition under different process requirements. It can maintain a high output efficiency when depositing 1 - micron aluminum alloy films, reduce particulate contamination and improve the yield.