ANELVA C - 7170C 物理气相沉积设备用途：适用于化合物半导体、功率 IC 及 MEMS 等领域。在化合物半导体中，常用于砷化镓、氮化镓等材料的金属电极沉积；功率 IC 制造时，可完成关键薄膜的沉积工艺；MEMS 生产中，助力相关薄膜的制备 。性能：具备高真空环境营造能力，能确保薄膜沉积过程的稳定性与高质量。设备的溅射速率可精准调控，满足不同薄膜厚度需求。在处理 8 英寸晶圆时，薄膜厚度均匀性良好，可实现复杂结构的均匀薄膜沉积 。

Product Name: ANELVA C - 7170C Physical Vapor Deposition EquipmentPurpose: It is suitable for fields such as compound semiconductors, power ICs, and MEMS. In compound semiconductors, it is often used for the deposition of metal electrodes in materials such as gallium arsenide and gallium nitride. During the manufacturing of power ICs, it can complete key thin - film deposition processes. In MEMS production, it helps with the preparation of related thin films.Performance: It has the ability to create a high - vacuum environment, ensuring the stability and high quality of the thin - film deposition process. The sputtering rate of the equipment can be precisely adjusted to meet different thin - film thickness requirements. When processing 8 - inch wafers, the film thickness uniformity is good, and uniform thin - film deposition for complex structures can be achieved.