MRC 903A 溅射系统用途：这是一款具备负载锁定功能的直流溅射设备，常用于科研及工业领域的薄膜制备。可在半导体制造中，为芯片溅射金属薄膜以实现电路连接；在光学领域，为镜片制备增透、反射等功能薄膜，提升光学性能 。性能：配备 3 个尺寸为 4¾”x14 7/8” 的直流阴极，无快门，基板通过链传动在工位间传送。具备射频蚀刻功能。升级了 PC 控制器，电源和真空规也有所升级。搭载 CTI 车载低温泵与前级泵。拥有 Advanced Energy rfx - 600 13.56MHz 600W 射频发生器及 TCM 匹配网络用于溅射蚀刻，还有 Advanced Energy mdx - 10k 直流磁控溅射电源 。

Product Name: MRC 903A Sputtering SystemPurpose: This is a DC sputtering equipment with load - lock function, often used for thin - film preparation in scientific research and industrial fields. In semiconductor manufacturing, it can sputter metal films on chips for circuit connection; in the optical field, it can prepare anti - reflection, reflective and other functional films for lenses to improve optical performance.Performance: It is equipped with 3 DC cathodes with a size of 4¾”x14 7/8”, has no shutter, and the substrate is transported between stations via chain drive. It has RF etch function. The PC controller has been upgraded, as well as the power supply and vacuum gauge. It is equipped with a CTI onboard cryopump and a roughing pump. It has an Advanced Energy rfx - 600 13.56MHz 600W RF generator and a TCM matching network for sputter etch, and an Advanced Energy mdx - 10k DC magnetron sputtering power supply.