瓦里安 VARIAN 3190用途：这是一款晶圆溅射系统，适用于半导体制造等领域，能在晶圆表面溅射沉积各类薄膜，满足芯片制造等工艺需求。性能：采用垂直式单晶圆处理，可处理 50mm 至 125mm 的晶圆，具备自动化的晶圆盒到晶圆盒（cassette - to - cassette）操作。系统配置有 3 个小型量子靶材，具备射频蚀刻功能和真空隔离处理站（VIPS）。搭载残余气体分析仪，可实时监测腔室环境。三个溅射电源功率各为 12kW，最高每小时能处理 60 片晶圆，可在不同工艺要求下实现高效且稳定的薄膜沉积，在沉积铝合金 1 微米薄膜时能保持较高的产出效率，减少颗粒污染，提高良品率 。

Product Name: VARIAN 3190Purpose: This is a wafer sputtering system, suitable for semiconductor manufacturing and other fields. It can sputter and deposit various thin films on the surface of wafers to meet the process requirements such as chip manufacturing.Performance: It adopts vertical single - wafer processing and can handle wafers from 50mm to 125mm, with automated cassette - to - cassette operation. The system is equipped with 3 mini - quantum targets, has an RF etch function and a vacuum - isolated processing station (VIPS). It is equipped with a residual gas analyzer to monitor the chamber environment in real - time. Each of the three sputtering power supplies has a power of 12kW. It can process up to 60 wafers per hour and can achieve efficient and stable thin - film deposition under different process requirements. It can maintain a high output efficiency when depositing 1 - micron aluminum alloy films, reduce particulate contamination and improve the yield.