TECHNICS HUMMER 6.2 溅射镀膜设备用途：适用于科研机构与高校进行材料表面改性及薄膜制备研究，也可用于小型企业生产光学薄膜、电子元件镀膜等。能在玻璃、硅片、金属片等多种基板上溅射金、银、铜等金属薄膜，以及二氧化硅、氮化硅等非金属薄膜 。性能：虽未找到公开的详细参数，但从设备功能推测，可能配备高效的真空系统，能快速将真空度提升至适合溅射的范围。具备精准的溅射功率调节装置，可精确控制薄膜生长速率，膜厚精度或达纳米级。配备多种溅射靶材安装位，方便切换不同材料靶材，以满足多样化的镀膜需求。可能还带有温度控制系统，保证溅射过程中基板温度稳定，提升薄膜质量 。

Product Name: TECHNICS HUMMER 6.2 Sputtering Coating EquipmentPurpose: It is suitable for research institutions and universities to conduct research on material surface modification and thin - film preparation, and can also be used by small enterprises for the production of optical films and the coating of electronic components. It can sputter metal films such as gold, silver, and copper, as well as non - metal films such as silicon dioxide and silicon nitride on various substrates such as glass, silicon wafers, and metal sheets.Performance: Although no detailed public parameters have been found, it can be inferred from the equipment functions that it may be equipped with an efficient vacuum system that can quickly increase the vacuum degree to a range suitable for sputtering. It has an accurate sputtering power adjustment device that can precisely control the film growth rate, and the film thickness accuracy may reach the nanometer level. It is equipped with multiple sputtering target mounting positions, which is convenient for switching different material targets to meet diverse coating needs. It may also be equipped with a temperature control system to ensure the stability of the substrate temperature during sputtering and improve the film quality.