CVP 溅射镀膜系统用途：属于科研级别的溅射沉积系统，适用于无毒材料的薄膜制备。在半导体、光学、材料研究等领域应用广泛，可用于制备集成电路前道制造中的物理气相沉积薄膜，以及光学元件的功能性薄膜等 。性能：该系统为多阴极系统，呈溅射朝上的配置方式。设有两个 6 英寸直流磁控靶站、一个 3 英寸射频站和一个 3 英寸直流磁控站。样品可安装在适配 3 英寸和 4 英寸晶圆的旋转台上，小样品也能通过转接座或小型夹具固定。采用低温泵实现高真空环境，溅射气体可选氩气和氮气，并能按任意比例混合。最大晶圆样品尺寸为 100 毫米，可接受整片晶圆或基片碎片。薄膜沉积最大厚度为 2 微米，靶材所允许的功率会根据材料或结合方式有所限制 。

Product Name: CVP Sputtering Coating SystemPurpose: It is a research - grade sputter deposition system suitable for the thin - film preparation of non - toxic materials. It is widely used in fields such as semiconductors, optics, and materials research. It can be used to prepare physical vapor deposition thin films in the front - end manufacturing of integrated circuits and functional thin films for optical components.Performance: This system is a multi - cathode system configured in a sputter - up manner. It has two 6 - inch DC magnetron target stations, one 3 - inch RF station, and one 3 - inch DC magnetron station. Samples can be mounted on a rotating table suitable for 3 - inch and 4 - inch wafers. Small samples can also be fixed with adapter mounts or small fixtures. A cryo - pump is used to achieve a high - vacuum environment. Argon and nitrogen are available as sputter gases and can be mixed in any desired ratio. The maximum wafer sample size is 100 mm, and whole wafers or substrate pieces are acceptable. The maximum film deposition thickness is 2 μm, and the power allowed to the targets is limited according to the material or bonding method.