ANELVA C - 7150C 溅射设备用途：适用于半导体制造领域，可在晶圆等基底上进行高质量薄膜沉积。常用于集成电路制造中的金属互连层、阻挡层等关键薄膜的制备，助力提升芯片性能与可靠性 。性能：具备高真空环境创建能力，能有效减少杂质对薄膜的影响。设备可精确控制溅射参数，如溅射功率、气体流量等，以实现稳定且精准的薄膜沉积。在处理 8 英寸晶圆时，薄膜厚度均匀性出色，能满足先进半导体工艺对薄膜一致性的严苛要求 。

Product Name: ANELVA C - 7150C Sputtering EquipmentPurpose: It is suitable for the semiconductor manufacturing field and can deposit high - quality thin films on substrates such as wafers. It is often used for the preparation of key thin films such as metal interconnect layers and barrier layers in integrated circuit manufacturing, helping to improve chip performance and reliability.Performance: It has the ability to create a high - vacuum environment, which can effectively reduce the impact of impurities on the thin film. The equipment can precisely control sputtering parameters such as sputtering power and gas flow to achieve stable and accurate thin - film deposition. When processing 8 - inch wafers, the film thickness uniformity is excellent, meeting the strict requirements of advanced semiconductor processes for film consistency.