日立 HITACHI E - 1030 离子溅射仪用途：是一款先进的薄膜沉积设备，适用于材料研究及薄膜制备。常用于在玻璃、金属、陶瓷等多种基底材料上，通过离子溅射沉积金属、氧化物、氮化物等薄膜，可应用于扫描电镜样品制备、半导体研究、光学薄膜制备等领域。性能：拥有高真空腔室，配备电子束加热阴极溅射源、用于装载基板支架的负载锁以及观察窗。有四个靶溅射源，其水冷可旋转阳极和水冷溅射靶能确保均匀沉积。基板支架带有加热腔，可承受 130W 热量，最高温度达 800°C 。设备具备先进的机器人系统，可实现机器人辅助上下料，配合多装载机实现高度自动化。通过图形用户界面进行过程控制、数据记录和统计分析，还能实时监控设备各组件 。

Product Name: Hitachi HITACHI E - 1030 Ion SputterPurpose: It is an advanced thin - film deposition equipment suitable for materials research and thin - film preparation. It is often used to deposit thin films of metals, oxides, nitrides, etc. on a variety of substrate materials such as glass, metal, and ceramic through ion sputtering. It can be applied in fields such as scanning electron microscopy sample preparation, semiconductor research, and optical thin - film preparation.Performance: It has a high - vacuum chamber equipped with an electron - beam - heated cathode sputter source, a load - lock for loading the substrate holder, and a viewing window. There are four target sputter sources, and their water - cooled rotatable anodes and water - cooled sputter targets can ensure uniform deposition. The substrate holder is equipped with a heating chamber that can withstand 130W of heat, with a maximum temperature of 800°C. The equipment has an advanced robotic system that can achieve robot - assisted loading and unloading of materials, and can realize a high degree of automation when used with a multi - loader. Process control, data recording, and statistical analysis are carried out through a graphical user interface, and each component of the equipment can be monitored in real - time.