ANELVA I-1060 SVII Plus 1 物理气相沉积溅射系统用途：适用于半导体制造、光学元件加工及材料研发等领域。在半导体制造中，可用于芯片的金属互连层、阻挡层等薄膜沉积；光学领域，能在镜片等元件上镀制功能性薄膜；材料研发方面，助力新型材料薄膜的开发 。性能：采用先进的磁控溅射技术，可实现高效、稳定的薄膜沉积。配备高精度溅射电源，功率控制精度达 ±0.1% 。针对常见金属靶材，溅射速率最高可达 100nm/min 。通过优化磁场设计与气体流量控制，4 - 8 英寸晶圆上薄膜厚度均匀性偏差能控制在 ±1% 以内 。支持直流、射频、脉冲溅射等多种工艺，满足不同材料与应用场景需求 。

Product Name: ANELVA I-1060 SVII Plus 1 Physical Vapor Deposition Sputtering SystemPurpose: It is suitable for fields such as semiconductor manufacturing, optical component processing, and material research and development. In semiconductor manufacturing, it can be used for the deposition of thin films such as metal interconnect layers and barrier layers in chips. In the optical field, it can coat functional films on components such as lenses. In material research and development, it helps with the development of new material thin films.Performance: It adopts advanced magnetron sputtering technology to achieve efficient and stable thin film deposition. It is equipped with a high - precision sputtering power supply with a power control accuracy of ±0.1%. For common metal targets, the sputtering rate can reach up to 100nm/min. Through optimized magnetic field design and gas flow control, the thickness uniformity deviation of the thin film on 4 - 8 inch wafers can be controlled within ±1%. It supports various processes such as DC sputtering, RF sputtering, and pulsed sputtering to meet the needs of different materials and application scenarios.