爱发科 ULVAC SIV - 200S用途：这是一款用于溅射工艺的设备，适用于光学薄膜、半导体、LED、功率器件及 MEMS 等领域。在光学领域，可用于制备 SiO、SiN 等光学薄膜；在半导体领域，能进行金属溅射，完成芯片制造中的金属电极、绝缘层等薄膜的溅射沉积工作。性能：采用可抑制 particle 产生的通过型竖直溅射方式，支持基板往复或 line 式搬送，提高生产效率。配备静电吸附系统与较大尺寸的静电托盘，刻蚀速率高于常规设备，产能更大。搭载 ULVAC SW - 1 皮拉尼真空计，能精准监测真空度，配合旋转泵等真空抽气系统，可快速营造稳定的真空环境。具备基板加热系统，包括加热机制、加热器电源与带过热热电偶的温度控制器，保障溅射工艺稳定进行 。

Product Name: ULVAC SIV - 200SPurpose: This is a device for sputtering processes, applicable to fields such as optical thin films, semiconductors, LEDs, power devices, and MEMS. In the optical field, it can be used to prepare optical thin films like SiO and SiN. In the semiconductor field, it can perform metal sputtering and complete the sputter deposition of thin films such as metal electrodes and insulating layers in chip manufacturing.Performance: It adopts a through - type vertical sputtering method that can suppress particle generation and supports reciprocating or line - type substrate transfer to improve production efficiency. It is equipped with an electrostatic adsorption system and a relatively large - sized electrostatic tray, with a higher etching rate and greater productivity than conventional devices. It is equipped with a ULVAC SW - 1 Pirani vacuum gauge to accurately monitor the vacuum degree. Together with a vacuum pumping system such as a rotary pump, it can quickly create a stable vacuum environment. It has a substrate heating system, including a heating mechanism, a heater power supply, and a temperature controller with an overheating thermocouple to ensure the stable progress of the sputtering process.