MRC 603 溅射系统用途：MRC 603 是一款工业级溅射设备，主要用于氧化物、氮化物和金属等薄膜材料的大批量生产。适用于半导体、光学等领域，可在晶圆、平板等基材上沉积薄膜，用于制造芯片、光学镜片等元器件。性能：采用不锈钢工艺腔室和负载锁定装置。配备 3 个标准的 5"x15" 磁控阴极组件，可同时处理多种材料。具备射频溅射刻蚀清洗功能并带有加热器，可选择 5kw 直流或射频溅射，支持偏压设置。最多可容纳 8 个基板支架，能同时运行多种材料溅射。拥有先进的基板支架设计，可放置晶圆、平板等。配备高分辨率射频发生器和可编程控制器，可精确设置压力、温度和流量等参数，还具备气体纯度传感器和数据分析平台等。

Product Name: MRC 603 Sputtering SystemPurpose: MRC 603 is an industrial - grade sputtering equipment, mainly used for high - volume production of thin - film materials such as oxides, nitrides, and metals. It is suitable for semiconductor, optical and other fields, and can deposit thin films on substrates such as wafers and flat panels, which are used to manufacture components such as chips and optical lenses.Performance: It adopts a stainless - steel process chamber and a load - lock device. Equipped with 3 standard 5"x15" magnetron cathode assemblies, it can handle multiple materials simultaneously. It has a RF sputter etch clean function with a heater, and can select 5kw DC or RF sputtering, with bias voltage setting supported. It can accommodate up to 8 substrate holders, enabling the sputtering of multiple materials at the same time. With an advanced substrate holder design, it can hold wafers, flat panels, etc. It is equipped with a high - resolution RF generator and a programmable controller, which can precisely set parameters such as pressure, temperature, and flow rate. It also has gas purity sensors and a data analysis platform, etc.