MAGNETRON SHS - 2M - 3 - 400TL 磁控溅射源用途：这是一款用于薄膜沉积的设备，适用于科研机构和工业生产中在各类基板上制备金属、氧化物等薄膜。在科研领域，可助力新材料研发，探索不同材料组合的薄膜特性；在工业方面，能应用于半导体制造、光学镀膜等行业，例如为半导体芯片溅射金属薄膜用于电路连接，为光学镜片镀制功能薄膜提升光学性能。性能：该设备具备多个溅射腔室（推测与 “2M” 相关），可同时进行多种材料溅射，提高生产效率。能搭载直径 400mm（对应 “400TL”）的溅射靶材，适用于较大尺寸基板镀膜。内部采用高效磁控结构，类似圆形稀土钕铁硼永磁体的磁配置，可实现良好的薄膜均匀性和较高的靶材利用率。设备整体结构紧凑，易于安装、操作与维护 。

Product Name: MAGNETRON SHS - 2M - 3 - 400TL Magnetron Sputtering SourcePurpose: This is a device for thin - film deposition, suitable for depositing metal, oxide and other thin films on various substrates in research institutions and industrial production. In the research field, it can assist in the development of new materials and explore the characteristics of thin films with different material combinations. In the industrial aspect, it can be applied to industries such as semiconductor manufacturing and optical coating. For example, it can sputter metal films on semiconductor chips for circuit connection and coat functional films on optical lenses to improve optical performance.Performance: This equipment has multiple sputtering chambers (presumably related to "2M"), which can simultaneously sputter multiple materials, improving production efficiency. It can carry a sputtering target with a diameter of 400mm (corresponding to "400TL"), which is suitable for coating larger - sized substrates. The internal high - efficiency magnetron structure, similar to the magnetic configuration of circular rare - earth neodymium - iron - boron permanent magnets, can achieve good film uniformity and high target utilization. The overall structure of the equipment is compact, easy to install, operate and maintain.