LEYBOLD Z550 射频磁控溅射系统用途：常用于科研和工业领域，可在多种基底材料上进行薄膜沉积，如在制备硅薄膜、PLZT 铁电薄膜、金膜等方面应用广泛，涵盖材料科学、电子学、光学等多个学科方向。性能：具备射频（RF）溅射功能，工作频率可达 13.56MHz。背景压力能低至5×10−5mbar，沉积时溅射压力约为6×10−3mbar。以制备金膜为例，溅射功率可达 600W，高纯氩气流量 4.5sccm ，可满足不同薄膜制备的工艺需求。

Product Name: LEYBOLD Z550 RF magnetron sputtering systemPurpose: It is often used in scientific research and industrial fields and can deposit thin films on a variety of substrate materials. It is widely used in the preparation of silicon films, PLZT ferroelectric films, gold films, etc., covering multiple disciplines such as materials science, electronics, and optics.Performance: It has an RF sputtering function with a working frequency of up to 13.56 MHz. The background pressure can be as low as 5×10−5 mbar, and the sputtering pressure during deposition is approximately 6×10−3 mbar. For example, when preparing gold films, the sputtering power can reach 600 W, and the high-purity argon gas flow rate is 4.5 sccm, which can meet the process requirements for different thin film preparations.