AMAT/APPLIED MATERIALS NAR 1800 Twin 垂直连线溅射机用途：适用于半导体制造等领域，主要用于在晶圆等基底材料上进行高质量薄膜溅射沉积。可满足如芯片制造过程中金属互连层、阻挡层等薄膜的制备需求 。性能：采用垂直连线设计，能高效处理晶圆。具备较短的循环时间，约 40 秒。可处理玻璃尺寸达 730mm x 920mm。设备的真空性能良好，入口 / 出口腔室真空度＜2e-02hPa，传输腔室＜5e-06hPa，工艺腔室＜5e-06hPa。其生产效率较高，吞吐量可达 360 片基板 / 小时（每载具 4 片），靶材利用率＞[具体数值未提及] 。

Product Name: AMAT/APPLIED MATERIALS NAR 1800 Twin Vertical In - Line Sputtering MachinePurpose: It is suitable for fields such as semiconductor manufacturing and is mainly used for high - quality thin - film sputtering deposition on substrate materials such as wafers. It can meet the requirements for the preparation of thin films such as metal interconnect layers and barrier layers during chip manufacturing.Performance: It adopts a vertical in - line design, which can efficiently process wafers. It has a short cycle time of about 40 seconds. It can process glass with a size of 730mm x 920mm. The equipment has good vacuum performance. The vacuum degree of the entrance/exit chamber is < 2e - 02hPa, the transfer chamber is < 5e - 06hPa, and the process chamber is < 5e - 06hPa. Its production efficiency is high, with a throughput of up to 360 substrates per hour (4 substrates per carrier), and the target utilization rate is > [specific value not mentioned].