MRC 603 III 溅射系统用途：该设备为紧凑型溅射装备，适用于小批量生产。可在半导体、光学等领域的多种圆形或平面基板上进行薄膜沉积，如为半导体芯片溅射金属薄膜实现电路连接，为光学镜片制备功能薄膜提升光学性能。性能：基于功率磁控溅射源，溅射腔由不锈钢打造并内衬石英，坚固耐用且便于清洁。内部先进的物理气相沉积（PVD）源，最大沉积速率达 4.25µm/min。拥有大容量腔室，配备多位置靶材支架，便于快速更换靶材。还设有阳极氧化铝保护罩，保护溅射腔壁。设备搭载车载计量单元，能实时分析，通过直观图形界面和数字信号处理器，可精准调控沉积参数 。

Product Name: MRC 603 III Sputtering SystemPurpose: This equipment is a compact sputtering device suitable for low - volume production. It can deposit thin films on a variety of round or flat substrates in fields such as semiconductors and optics. For example, it can sputter metal films on semiconductor chips for circuit connection and prepare functional films for optical lenses to improve optical performance.Performance: Based on a powered - magnetron sputtering source, the sputtering chamber is made of stainless steel and lined with quartz, which is sturdy, durable, and easy to clean. The advanced physical vapor deposition (PVD) source inside has a maximum deposition rate of 4.25 µm/min. It has a large - volume chamber, equipped with a multi - position target holder for quick target replacement. There is also a protective cover made of anodized aluminium to protect the sputtering chamber walls. The equipment is equipped with an on - board metering unit for real - time analysis. Through an intuitive graphical interface and a digital signal processor, deposition parameters can be precisely regulated.