ANELVA ILC 1060 物理气相沉积（PVD）溅射系统用途：适用于半导体、光学及材料研究等领域。在半导体制造中，常用于芯片的金属互连层、阻挡层等薄膜沉积；光学领域可在镜片等元件上镀制提高透光率或反射率的功能性薄膜；材料研究方面，助力研发新型材料薄膜 。性能：采用先进的磁控溅射技术，能实现高效、稳定的薄膜沉积。可精确调控溅射功率，功率控制精度达 ±0.1%，确保溅射能量输出稳定。针对常见金属靶材，溅射速率最高可达 100nm/min 。优化的磁场与气体流量控制，使 4-8 英寸晶圆上薄膜厚度均匀性偏差控制在 ±1% 以内 。支持直流、射频、脉冲溅射等多种工艺，可满足不同材料与应用场景需求 。

Product Name: ANELVA ILC 1060 Physical Vapor Deposition (PVD) Sputtering SystemPurpose: It is suitable for fields such as semiconductors, optics, and materials research. In semiconductor manufacturing, it is often used for the deposition of thin films such as metal interconnect layers and barrier layers in chips. In the optical field, it can coat functional films on components such as lenses to improve light transmittance or reflectance. In materials research, it helps with the development of new material thin films.Performance: It adopts advanced magnetron sputtering technology to achieve efficient and stable thin film deposition. The sputtering power can be precisely adjusted with a power control accuracy of ±0.1% to ensure stable sputtering energy output. For common metal targets, the sputtering rate can reach up to 100nm/min. With optimized magnetic field and gas flow control, the thickness uniformity deviation of the thin film on 4 - 8 inch wafers can be controlled within ±1%. It supports various processes such as DC sputtering, RF sputtering, and pulsed sputtering to meet the needs of different materials and application scenarios.