DENTON VACUUM Desktop II 薄膜沉积系统用途：适用于科研及工业领域，可在半导体、光学、材料等行业的各类基底上，沉积金属、半导体、聚合物、氧化物和氮化物等涂层材料，常用于扫描电镜（SEM）样本的导电涂层制备、光学镜片的功能薄膜沉积等。性能：具备 6 英寸直径的 Pyrex 腔室，采用磁控溅射头，支持射频（RF）或直流（DC）电源，可灵活溅射多种材料。拥有可旋转、倾斜的样品台，能确保不规则样品表面均匀镀膜。支持热蒸发与溅射两种工艺，具备薄膜厚度监测仪，可精确控制镀膜厚度。操作方式有手动和自动可选，配备直观的操作界面，沉积速率约为 5nm/min 。

Product Name: DENTON VACUUM Desktop II Thin Film Deposition SystemPurpose: It is suitable for scientific research and industrial fields. It can deposit coating materials such as metals, semiconductors, polymers, oxides, and nitrides on various substrates in industries like semiconductors, optics, and materials. It is often used for preparing conductive coatings for scanning electron microscope (SEM) samples and depositing functional films on optical lenses.Performance: It has a 6 - inch - diameter Pyrex chamber and adopts a magnetron sputter head. It supports radio - frequency (RF) or direct - current (DC) power supplies, enabling flexible sputtering of various materials. It has a rotatable and tiltable sample stage to ensure uniform coating on the surfaces of irregular samples. It supports two processes: thermal evaporation and sputtering. It is equipped with a film thickness monitor to accurately control the coating thickness. There are options for manual and automatic operation, and it is equipped with an intuitive operation interface. The deposition rate is approximately 5nm/min.