MRC 902M 溅射系统用途：这是一款适用于半导体及材料研究领域的溅射设备。可在半导体芯片制造过程中，为芯片表面溅射金属或介质薄膜，满足电路连接、绝缘等需求；在材料研究方面，助力研发新型薄膜材料，探究不同材料组合及工艺下薄膜的特性 。性能：采用两级负载锁定设计，机械抽真空。具备两个溅射工位，Sput 1 和 Sput 2 为射频 / 直流磁控阴极，可灵活选择不同溅射模式。第三个工位设置为蚀刻站，用于样品表面处理。设备搭载低温泵，可有效提升真空环境质量，保障溅射过程的稳定性。可运行射频 / 直流工艺，支持基板加热与蚀刻功能，以满足多样化的薄膜制备需求 。

Product Name: MRC 902M Sputtering SystemPurpose: This is a sputtering equipment suitable for the semiconductor and materials research fields. During semiconductor chip manufacturing, it can sputter metal or dielectric films on the chip surface to meet the requirements of circuit connection and insulation. In materials research, it helps develop new thin - film materials and explore the characteristics of thin films under different material combinations and processes.Performance: It adopts a two - stage load - lock design and is mechanically evacuated. It has two sputtering stations, with Sput 1 and Sput 2 being RF/DC magnetron cathodes, allowing flexible selection of different sputtering modes. The third station is set as an etch station for sample surface treatment. The equipment is equipped with a cryo - pump, which can effectively improve the quality of the vacuum environment and ensure the stability of the sputtering process. It can run RF/DC processes and supports substrate heating and etching functions to meet diverse thin - film preparation needs.