爱发科 ULVAC Entron 系列多腔室薄膜沉积系统用途：适用于半导体逻辑芯片、存储器（包括 DRAM、NAND 及新一代非易失性存储器）以及封装等尖端产品生产2。可用于铝、钨等金属配线制程，能搭载 “ULTiNA” 溅射模组形成氮化钛膜，用于硬掩膜等工艺4。性能：采用即插即用平台设计，模块更换时间较原机型缩短 50%2。系统最多可配置 12 个模块，包括 8 个工艺模块等2。机械吞吐量可达 100wph 或更高1。有 S 型（单一型）和 T 型（串联型）可选，S 型适合小型晶圆厂，T 型适合大规模生产1。可配备 ED - PMS 系统监控设备状态，以及 MESEC - BIT 非接触式膜厚测量设备6。

Product Name: ULVAC Entron Series Multi - chamber Thin - film Deposition SystemPurpose: It is suitable for the production of advanced products such as semiconductor logic chips, memories (including DRAM, NAND and new - generation non - volatile memories) and packaging2. It can be used in metal wiring processes such as aluminum and tungsten, and can be equipped with the "ULTiNA" sputtering module to form titanium nitride films for processes like hard - mask4.Performance: It adopts a plug - and - play platform design, and the module replacement time is 50% shorter than that of the original model2. The system can be configured with up to 12 modules, including 8 process modules, etc2. The mechanical throughput can reach 100wph or more1. There are S - type (single - type) and T - type (tandem - type) available. The S - type is suitable for small - scale wafer fabs, and the T - type is suitable for mass production1. It can be equipped with the ED - PMS system to monitor the equipment status and the MESEC - BIT non - contact film - thickness measurement equipment6.