爱发科 ULVAC ei - 7L用途：这是一款批次型高真空蒸发系统，主要用于在基板上沉积金属和氧化物薄膜。适用于从研发到小规模制造等多种场景，支持诸如电子束（EB）、电阻加热（RH）等多种蒸发源。能适配从直径 2 英寸到 6 英寸的圆形基板、矩形基板，以及硅、化合物、玻璃和陶瓷等不同材质的基板，在半导体、光学、材料研究等行业有着广泛应用。性能：可选用与不同工艺适配的基板支架，如剥离工艺、行星式、卫星式等。操作通过 LCD 触摸面板完成，搭载性能优越的 PC 操作系统，具备配方功能、数据记录和维护辅助功能等。虽无公开的详细量化参数，但从其功能设计可知，能稳定实现自动化真空和沉积流程，满足多样化的薄膜制备需求 。

Product Name: ULVAC ei - 7LPurpose: This is a batch - type high - vacuum evaporation system mainly used for depositing metal and oxide thin films on substrates. It is suitable for various scenarios ranging from R & D to small - scale manufacturing. It supports various evaporation sources such as electron beam (EB) and resistance heating (RH). It can be adapted to round substrates with a diameter from 2 inches to 6 inches, rectangular substrates, and different materials of substrates such as silicon, compounds, glass, and ceramics, and is widely used in industries such as semiconductors, optics, and materials research.Performance: Substrate holders compatible with different processes, such as lift - off, planetary, satellite, etc., can be selected. The operation is completed through an LCD touch panel, and it is equipped with a superior PC operating system with functions such as recipe function, data logging, and maintenance assist function. Although there are no publicly available detailed quantitative parameters, from its functional design, it can stably achieve automated vacuum and deposition processes to meet diverse thin - film preparation requirements.