瓦里安 VARIAN 3290 STQ 溅射沉积系统用途：该设备用于在 6 英寸晶圆上进行高质量薄膜沉积，适用于半导体等行业。可精准控制薄膜厚度与均匀性，通过独特工艺实现晶圆间的高度重复性，保障产品一致性。性能：采用创新的双阴极磁控溅射源，能出色调控薄膜厚度与均匀性。支持单个晶圆处理，在所有工艺步骤中，晶圆与源的几何结构固定，确保晶圆间的高重复性。仅将晶圆引入沉积腔，最大程度保证系统清洁。具备晶圆盒到晶圆盒的自动传输功能，晶圆全程垂直放置，减少污染、提高良率。可选择 3 相 200、208、360 或 480V、60Hz 电源，拥有多种配置选项，如两类溅射源、带 “VIPS” 的射频蚀刻、偏压加热器、负载锁定涡轮泵、配方控制加热器等 。

Product Name: VARIAN 3290 STQ Sputtering Deposition SystemPurpose: This equipment is used for high - quality thin - film deposition on 6 - inch wafers and is suitable for industries such as semiconductors. It can precisely control the film thickness and uniformity, and achieve high repeatability between wafers through a unique process, ensuring product consistency.Performance: It adopts an innovative dual - cathode magnetron sputtering source, which can excellently regulate the film thickness and uniformity. It supports individual wafer processing. During all process steps, the geometry of the wafer and the source is fixed, ensuring high repeatability between wafers. Only the wafer is introduced into the deposition chamber, maximizing the cleanliness of the system. It has an automatic transfer function from cassette to cassette. The wafers are placed vertically throughout the process, reducing contamination and increasing the yield. It can select 3 - phase power supplies of 200, 208, 360 or 480V, 60Hz, and has a variety of configuration options, such as two types of sputtering sources, RF etch with "VIPS", biased heaters, load - lock turbo pumps, recipe - controlled heaters, etc.