爱发科 ULVAC CS - 200用途：这是一款紧凑型负载锁式溅射系统，适用于研发以及中小型规模生产。在半导体领域，可用于制备芯片的导电膜、绝缘膜等；在 LED 行业，助力薄膜沉积以优化发光性能；在电力电子方面，能为相关器件提供功能性薄膜；高校及研究所也常用其开展材料薄膜相关研究 。性能：配备负载锁，可使基板在不破坏真空的情况下进入工艺腔室。工艺腔室在基板转移过程中能维持真空状态。负载锁腔室设有基板搬运装置，最大可转移 φ300mm 的基板。该系统拥有 4 英寸磁控阴极，可用于多种材料溅射，具备多层沉积或共溅射能力，最多可容纳 4 组 4 英寸磁控阴极。沉积方式有向上沉积和向下沉积可选，还可通过射频偏压在工艺腔室内进行预清洗 。

Product Name: ULVAC CS - 200Purpose: This is a compact load - lock type sputtering system, suitable for research and development as well as small and medium - scale production. In the semiconductor field, it can be used to prepare conductive films, insulating films, etc. for chips. In the LED industry, it helps with thin - film deposition to optimize light - emitting performance. In power electronics, it can provide functional films for related devices. Universities and research institutes also commonly use it to carry out research on material thin films.Performance: Equipped with a load - lock, substrates can enter the process chamber without breaking the vacuum. The process chamber can maintain a vacuum state during substrate transfer. The load - lock chamber is equipped with a substrate handling device, capable of transferring substrates with a maximum diameter of φ300mm. The system has a 4 - inch magnetron cathode for sputtering various materials, with multi - layer deposition or co - sputtering capabilities. Up to 4 sets of 4 - inch magnetron cathodes can be accommodated. The deposition methods include deposition up and deposition down, and pre - cleaning can be carried out in the process chamber via RF bias.